Invention Grant
- Patent Title: Light emitting apparatus and multi-surface pattern substrate
- Patent Title (中): 发光装置和多表面图案基板
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Application No.: US13218677Application Date: 2011-08-26
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Publication No.: US08563992B2Publication Date: 2013-10-22
- Inventor: Hideaki Kato , Yasutaka Higuchi
- Applicant: Hideaki Kato , Yasutaka Higuchi
- Applicant Address: JP Saitama
- Assignee: Enplas Corporation
- Current Assignee: Enplas Corporation
- Current Assignee Address: JP Saitama
- Agency: Washida & Associates
- Priority: JP2010-196766 20100902
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
A light emitting apparatus includes a belt-like substrate, a light emitting element mounted on the substrate, and a luminous flux control member mounted on the substrate. The substrate has a pair of fracture surfaces formed at predetermined intervals along a lengthwise direction and formed at both ends in a widthwise direction between luminous flux control members neighboring each other along the lengthwise direction, wherein dimensions W1 and W2 in the widthwise direction between the pair of fracture surfaces are less than a dimension in the widthwise direction of the luminous flux control member, and the dimension W2 in the widthwise direction of a part overlapping the luminous flux control member in a plan view is less than the dimension W1 in the widthwise direction between the pair of fracture surfaces.
Public/Granted literature
- US20120056210A1 LIGHT EMITTING APPARATUS AND MULTI-SURFACE PATTERN SUBSTRATE Public/Granted day:2012-03-08
Information query
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