Invention Grant
- Patent Title: Package for electronic component, manufacturing method thereof and sensing apparatus
- Patent Title (中): 电子部件用包装及其制造方法以及感应装置
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Application No.: US12643391Application Date: 2009-12-21
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Publication No.: US08564077B2Publication Date: 2013-10-22
- Inventor: Akinori Shiraishi , Masahiro Sunohara , Hideaki Sakaguchi , Yuichi Taguchi , Mitsutoshi Higashi
- Applicant: Akinori Shiraishi , Masahiro Sunohara , Hideaki Sakaguchi , Yuichi Taguchi , Mitsutoshi Higashi
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP.2008-328343 20081224; JPP.2009-240077 20091019
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L23/52 ; H01L21/50
Abstract:
A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.
Public/Granted literature
- US20100155862A1 PACKAGE FOR ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND SENSING APPARATUS Public/Granted day:2010-06-24
Information query
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