A method is presented for creating multilayer bond pads for bonding a disk drive suspension circuit to a read-write head slider. The multilayer bond pads eliminate the need for vias to transition signals between metallization layers within a suspension circuit. The method includes the steps of forming an aperture through an insulating material that has a metalized first side, depositing a second metal layer on the second side and within the aperture, the second metal layer forming an electrical contact with the first metal layer, selectively removing portions of the second metal layer within the aperture and corresponding adjacent portions of the first metal layer thereby dividing the second metal layer and respectively adjacent portions of the first metal layer into a plurality of electrically separated circuit bond pads, each bond pad including respective portions of the first metal layer and respectively adjacent portions of the second metal layer.