Invention Grant
- Patent Title: Heat exhaustion structure for heat dissipating device
- Patent Title (中): 散热装置散热结构
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Application No.: US13025533Application Date: 2011-02-11
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Publication No.: US08564947B2Publication Date: 2013-10-22
- Inventor: Chang Soo Kwak
- Applicant: Chang Soo Kwak
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Nelson Mullins Riley & Scarborough LLP
- Priority: KR10-2010-0013297 20100212; KR10-2010-0088728 20100910
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34 ; G06F1/20
Abstract:
A heat exhaustion structure for a heat dissipating device is provided. The present invention relates to a heat exhaustion structure for a heat dissipating device, and more particularly, to a heat exhaustion structure that may effectively exhaust an internal heat generated by heat dissipating devices included in a semiconductor package and in a large number of electronic products.
Public/Granted literature
- US20110198058A1 HEAT EXHAUSTION STRUCTURE FOR HEAT DISSIPATING DEVICE Public/Granted day:2011-08-18
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