Invention Grant
US08565910B2 Manufacturing execution system (MES) including a wafer sampling engine (WSE) for a semiconductor manufacturing process
有权
制造执行系统（MES），包括用于半导体制造过程的晶片采样引擎（WSE）
- Patent Title: Manufacturing execution system (MES) including a wafer sampling engine (WSE) for a semiconductor manufacturing process
- Patent Title (中): 制造执行系统（MES），包括用于半导体制造过程的晶片采样引擎（WSE）
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Application No.: US13020846Application Date: 2011-02-04
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Publication No.: US08565910B2Publication Date: 2013-10-22
- Inventor: Gary W. Behm , Malek Ben Salem , Yue Li
- Applicant: Gary W. Behm , Malek Ben Salem , Yue Li
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Ian MacKinnon
- Main IPC: G05B13/02
- IPC: G05B13/02
Abstract:
A method of sampling semiconductor wafers includes passing a lot of semiconductor wafers into a semiconductor processing tool, processing a first portion of the lot in one process chamber of the semiconductor processing tool and a second portion of the lot in another process chamber of the semiconductor processing tool to produce processed semiconductor wafers, and initiating a wafer sampling engine to select at least one of the processed semiconductor wafers for sampling. The wafer sampling engine computes a long term process capability index for the processing tool and a short term process performance index for at least one of the processing tool and process chamber, identifies at least one desired sampling measurement type, selects the at least one of the processed semiconductor wafers for sampling, and collects the desired measurement types from the at least one of the processed semiconductor wafers selected for sampling.
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