Invention Grant
US08566538B2 Administering thermal distribution among memory modules with call stack frame size management
有权
通过调用堆栈帧大小管理来管理内存模块之间的热分配
- Patent Title: Administering thermal distribution among memory modules with call stack frame size management
- Patent Title (中): 通过调用堆栈帧大小管理来管理内存模块之间的热分配
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Application No.: US13210509Application Date: 2011-08-16
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Publication No.: US08566538B2Publication Date: 2013-10-22
- Inventor: Cary L. Bates , Nicholas P. Johnson , Justin K. King
- Applicant: Cary L. Bates , Nicholas P. Johnson , Justin K. King
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Biggers & Ohanian, LLP
- Main IPC: G06F12/00
- IPC: G06F12/00

Abstract:
Administering thermal distribution among memory modules in a computing system that includes temperature sensors, where each temperature sensor measures temperature of a memory module and thermal distribution is effected by: determining, in real-time by a user-level application in dependence upon the temperature measurements of the temperature sensors, whether a memory module is overheated; if a memory module is overheated and if a current call stack frame is stored on the overheated memory module, increasing, by the user-level application, a size of the current call stack frame to fill remaining available memory space on the overheated memory module, ensuring a subsequent call stack frame is stored on a different memory module.
Public/Granted literature
- US20130046952A1 Administering Thermal Distribution Among Memory Modules With Call Stack Frame Size Management Public/Granted day:2013-02-21
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