A microstructure device that includes at least one thermally compensating anchor for preventing undesirable thermal displacement or actuation during manufacturing or operation is disclosed. In particular, the microstructure device includes a substrate and a movable structure suspended above the substrate by at least one anchor. The anchor is attached to the substrate. The anchor also includes an upper area of an upper surface region of a bottom portion attached to a lower surface of a proximal portion of the movable structure. The anchor further includes a top portion having a lower area of a lower surface region attached to an upper surface of the proximal portion of the movable structure, wherein the lower surface region of the top portion and the upper surface region of the bottom portion are geometrically asymmetric.