Invention Grant
- Patent Title: Protection apparatus for load circuit
- Patent Title (中): 负载电路保护装置
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Application No.: US12997385Application Date: 2009-06-10
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Publication No.: US08570700B2Publication Date: 2013-10-29
- Inventor: Akinori Maruyama , Yoshihide Nakamura , Keisuke Ueta
- Applicant: Akinori Maruyama , Yoshihide Nakamura , Keisuke Ueta
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-155437 20080613
- International Application: PCT/JP2009/060634 WO 20090610
- International Announcement: WO2009/151084 WO 20091217
- Main IPC: H02H5/04
- IPC: H02H5/04 ; H02G3/20 ; H02H9/04 ; H02H9/08

Abstract:
There is provided a protection apparatus for a load circuit, capable of protecting the load circuit by simulating a fuse. A pseudo heat capacity Cth* smaller than a heat capacity of an electric wire used in the load circuit is set, and a temperature of the electric wire is calculated with reference to an arithmetic expression of heat generation amount of the electric wire, an arithmetic expression of heat radiation amount of the electric wire, a time counted by the count unit, and the pseudo heat capacity Cth*. Then, a semiconductor relay S1 is interrupted when the calculated temperature of the electric wire reaches an allowable temperature of the electric wire to protect the load circuit from heat generation.
Public/Granted literature
- US20110080681A1 PROTECTION APPARATUS FOR LOAD CIRCUIT Public/Granted day:2011-04-07
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