Invention Grant
- Patent Title: Electrical connector assembly
- Patent Title (中): 电连接器总成
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Application No.: US13310101Application Date: 2011-12-02
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Publication No.: US08570745B2Publication Date: 2013-10-29
- Inventor: Ted Ju , Chin Chi Lin
- Applicant: Ted Ju , Chin Chi Lin
- Applicant Address: TW Keelung
- Assignee: Lotes Co., Ltd.
- Current Assignee: Lotes Co., Ltd.
- Current Assignee Address: TW Keelung
- Agency: Morris Manning & Martin LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: CN201120366791U 20110926
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/14

Abstract:
The invention relates to an electrical connector assembly. The electrical connector assembly includes a main circuit board having a through hole, a processor, and an auxiliary circuit board. The processor includes a chip and a substrate. The chip is electrically connected to the substrate and located in the through hole. The substrate is at least partially located in the through hole. The auxiliary circuit board has a transitional connecting surface. A first conducting region and a second conducting region electrically connected to each other are disposed on the transitional connecting surface. The first conducting region is electrically connected to the substrate, and the second conducting region is electrically connected to the main circuit board.
Public/Granted literature
- US20130077252A1 ELECTRICAL CONNECTOR ASSEMBLY Public/Granted day:2013-03-28
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