A serial advanced technology attachment dual-in-line memory module (SATA DIMM) device assembly includes an interface, a cable, and a board. An edge connector is set on a bottom edge of the board, and a control chip and a connector are arranged on the board. The connector includes a first shell and a number of first pins. The first pins include signal pins connected to the control chip, and ground pins. The interface includes a second shell and a connecting portion extended from a bottom of the second shell. A number of second pins are arranged on the connecting portion. The cable is extended through a side of the second shell to be connected to the first pins. A distance between a top of the first shell and a top of the board is greater than a height of the second shell.