Invention Grant
US08571837B1 System and method for simulating a bi-directional connect module within an analog and mixed-signal circuit
有权
用于在模拟和混合信号电路中模拟双向连接模块的系统和方法
- Patent Title: System and method for simulating a bi-directional connect module within an analog and mixed-signal circuit
- Patent Title (中): 用于在模拟和混合信号电路中模拟双向连接模块的系统和方法
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Application No.: US12838348Application Date: 2010-07-16
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Publication No.: US08571837B1Publication Date: 2013-10-29
- Inventor: Junwei Hou
- Applicant: Junwei Hou
- Applicant Address: US CA San Jose
- Assignee: Cadence Design Systems, Inc.
- Current Assignee: Cadence Design Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Kenyon & Kenyon LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
According to some embodiments, a method is provided for simulating an analog and mixed-signal circuit design comprising an analog circuit segment connected to a digital circuit segment at a connection point, the method comprising: inserting a bi-directional interface element at the connection point, wherein the analog circuit segment connects to an analog port of the bi-directional interface element and the digital circuit segment connects to a digital port of the bi-directional interface element; and operating the bi-directional interface element such that the bi-directional interface element detects a signal direction and, according to the signal direction, either converts a first analog signal received from the analog port to a first digital signal for the digital port while maintaining a first signal strength of the first analog signal, or converts a second digital signal received from the digital port to a second analog signal for the analog port while maintaining a second signal strength of the second digital signal.
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