Invention Grant
US08571837B1 System and method for simulating a bi-directional connect module within an analog and mixed-signal circuit 有权
用于在模拟和混合信号电路中模拟双向连接模块的系统和方法

  • Patent Title: System and method for simulating a bi-directional connect module within an analog and mixed-signal circuit
  • Patent Title (中): 用于在模拟和混合信号电路中模拟双向连接模块的系统和方法
  • Application No.: US12838348
    Application Date: 2010-07-16
  • Publication No.: US08571837B1
    Publication Date: 2013-10-29
  • Inventor: Junwei Hou
  • Applicant: Junwei Hou
  • Applicant Address: US CA San Jose
  • Assignee: Cadence Design Systems, Inc.
  • Current Assignee: Cadence Design Systems, Inc.
  • Current Assignee Address: US CA San Jose
  • Agency: Kenyon & Kenyon LLP
  • Main IPC: G06F17/50
  • IPC: G06F17/50
System and method for simulating a bi-directional connect module within an analog and mixed-signal circuit
Abstract:
According to some embodiments, a method is provided for simulating an analog and mixed-signal circuit design comprising an analog circuit segment connected to a digital circuit segment at a connection point, the method comprising: inserting a bi-directional interface element at the connection point, wherein the analog circuit segment connects to an analog port of the bi-directional interface element and the digital circuit segment connects to a digital port of the bi-directional interface element; and operating the bi-directional interface element such that the bi-directional interface element detects a signal direction and, according to the signal direction, either converts a first analog signal received from the analog port to a first digital signal for the digital port while maintaining a first signal strength of the first analog signal, or converts a second digital signal received from the digital port to a second analog signal for the analog port while maintaining a second signal strength of the second digital signal.
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