Invention Grant
- Patent Title: Solving hybrid constraints to validate specification requirements of a software module
- Patent Title (中): 解决混合约束以验证软件模块的规范要求
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Application No.: US12837818Application Date: 2010-07-16
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Publication No.: US08572574B2Publication Date: 2013-10-29
- Inventor: Indradeep Ghosh , Daryl R. Shannon
- Applicant: Indradeep Ghosh , Daryl R. Shannon
- Applicant Address: JP Kawasaki-shi
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki-shi
- Agency: Baker Botts L.L.P.
- Main IPC: G06F9/44
- IPC: G06F9/44

Abstract:
In one embodiment, a software module is validated according to requirements associated with the software module. The software module has numeric and string variables, and is associated with first numeric constrains and first string constraints. Second numeric constraints applying to specific numeric variables and second string constraints applying to specific string variables are inferred. Each numeric constraint is represented with an equation, and each string constraint is represented with a finite state machine. Attempt to solve a solution for the numeric and string variables that satisfies all the first and second numeric constraints, all the first and second string constraints, and all the requirements associated with the software module by iteratively testing different possible values for the numeric and string variables.
Public/Granted literature
- US20120017117A1 Solving Hybrid Constraints to Validate Specification Requirements of a Software Module Public/Granted day:2012-01-19
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