Invention Grant
- Patent Title: Component mounting structures
- Patent Title (中): 组件安装结构
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Application No.: US12209435Application Date: 2008-09-12
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Publication No.: US08572828B2Publication Date: 2013-11-05
- Inventor: Toshihiro Sakai , Akihisa Hotta , Koji Katano , Toshiyuki Inagaki , Nobutaka Teshima
- Applicant: Toshihiro Sakai , Akihisa Hotta , Koji Katano , Toshiyuki Inagaki , Nobutaka Teshima
- Applicant Address: JP Obu-shi, Aichi-ken JP Toyota-shi, Aichi-ken
- Assignee: Aisan Kogyo Kabushiki Kaisha,Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Aisan Kogyo Kabushiki Kaisha,Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Obu-shi, Aichi-ken JP Toyota-shi, Aichi-ken
- Agency: Ladas & Parry, LLP
- Priority: JP2007-239074 20070914
- Main IPC: B21D39/03
- IPC: B21D39/03
Abstract:
The present invention includes a mounting structure for mounting a component between a first member and a second member. According to the mounting structure, the component is first placed on a surface of the first member. Then, the second member is fitted with the component by a fitting device, so that the component is positioned relative to the second member. Thereafter, the component is fixed in position relative to the first member by a joint device.
Public/Granted literature
- US20090070981A1 COMPONENT MOUNTING STRUCTURES Public/Granted day:2009-03-19
Information query
