Invention Grant
- Patent Title: Curved profile seed pans
- Patent Title (中): 弯曲轮廓种子盘
-
Application No.: US13499443Application Date: 2010-09-23
-
Publication No.: US08572942B2Publication Date: 2013-11-05
- Inventor: Dave Dietrich
- Applicant: Dave Dietrich
- Agency: Akerman Senterfitt
- Agent Peter A. Chiabotti
- Priority: CA2681445 20091001
- International Application: PCT/CA2010/001521 WO 20100923
- International Announcement: WO2011/038490 WO 20110407
- Main IPC: A01D41/08
- IPC: A01D41/08 ; A01D45/00

Abstract:
A seed pan apparatus has an elongated seed pan plate with parallel right and left edges, a curved configuration and a pointed front end. An engagement mechanism attaches the plate to a harvester cutting header such that the plate is above two adjacent guard fingers, such that an open slot is defined between the right edge of one plate and the left edge of an adjacent plate and the edges of the slot are in proximity to the outer edges of the guard fingers under the adjacent plates. The point is offset to make one front tapering edge forming the point longer than the other. The inclination, height, and fore and aft position of the seed pan plate can be adjusted.
Public/Granted literature
- US20120186215A1 Seed Pans Public/Granted day:2012-07-26
Information query