Invention Grant
US08573063B2 Height adjustment structure of printed circuit board and height adjustment method thereof 有权
印刷电路板的高度调节结构及其高度调节方法

  • Patent Title: Height adjustment structure of printed circuit board and height adjustment method thereof
  • Patent Title (中): 印刷电路板的高度调节结构及其高度调节方法
  • Application No.: US13111566
    Application Date: 2011-05-19
  • Publication No.: US08573063B2
    Publication Date: 2013-11-05
  • Inventor: Tzu-Chih Lin
  • Applicant: Tzu-Chih Lin
  • Applicant Address: TW Hsinchu
  • Assignee: Altek Corporation
  • Current Assignee: Altek Corporation
  • Current Assignee Address: TW Hsinchu
  • Agency: Wang Law Firm, Inc.
  • Agent Li K. Wang; Stephen Hsu
  • Priority: TW99147424A 20101231
  • Main IPC: G01N3/20
  • IPC: G01N3/20
Height adjustment structure of printed circuit board and height adjustment method thereof
Abstract:
A height adjustment structure of printed circuit board and the adjustment method thereof are disclosed. The height adjustment structure includes an electronic device main body, a circuit board body and an adjusting component. The electronic device main body includes at least one fixing part. The circuit board body is disposed on a surface of the electronic device main body at which the fixing part is located. The circuit board body includes at least one stuck part, wherein the stuck part is disposed along the edge of the circuit board body and corresponds to the fixing part; further, the stuck part recesses inwards into the circuit board body to form a U shape. One end of the adjusting component movably penetrates the fixing part and being screw locked thereon, and another end of the adjusting component is embedded to the stuck part.
Information query
Patent Agency Ranking
0/0