Invention Grant
US08573390B2 Material transport systems including a transport belt having resistance to laser radiation damage and methods of cutting substrates in material transport systems with laser radiation 有权
材料输送系统包括具有耐激光辐射损伤的输送带和用激光辐射在材料输送系统中切割基材的方法

Material transport systems including a transport belt having resistance to laser radiation damage and methods of cutting substrates in material transport systems with laser radiation
Abstract:
Material transport systems including a radiation-resistant transport belt and methods of cutting substrates transported in the material transport systems are provided. An exemplary material transport system includes a continuous transport belt entrained on at least a first roll and a second roll. The transport belt includes at least a first layer and a second layer over the first layer. The first layer includes an inner surface of the transport belt and the second layer includes an outer surface of the transport belt. The second layer can be comprised of copper, copper-based alloys, aluminum, aluminum-based alloys or nickel.
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