Invention Grant
- Patent Title: Ultrasonic bonding systems and methods of using the same
- Patent Title (中): 超声波接合系统及其使用方法
-
Application No.: US13941922Application Date: 2013-07-15
-
Publication No.: US08573468B1Publication Date: 2013-11-05
- Inventor: Christoph B. Luechinger , Orlando L. Valentin , Tao Xu
- Applicant: Orthodyne Electronics Corporation
- Applicant Address: US CA Irvine
- Assignee: Orthodyne Electronics Corporation
- Current Assignee: Orthodyne Electronics Corporation
- Current Assignee Address: US CA Irvine
- Agent Christopher M. Spletzer, Sr.
- Main IPC: B23K20/10
- IPC: B23K20/10 ; B23K31/02
Abstract:
An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.
Public/Granted literature
- US20130299559A1 ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME Public/Granted day:2013-11-14
Information query
