Invention Grant
- Patent Title: Fluid-filled vibration damping device
- Patent Title (中): 流体填充减振装置
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Application No.: US12708220Application Date: 2010-02-18
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Publication No.: US08573570B2Publication Date: 2013-11-05
- Inventor: Hiroyuki Ichikawa , Yuichi Ogawa , Naoki Furumachi , Katsuhiro Sakurai , Nobuya Yoshida
- Applicant: Hiroyuki Ichikawa , Yuichi Ogawa , Naoki Furumachi , Katsuhiro Sakurai , Nobuya Yoshida
- Applicant Address: JP Komaki JP Toyota
- Assignee: Tokai Rubber Industries, Ltd.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Tokai Rubber Industries, Ltd.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Komaki JP Toyota
- Agency: Oliff & Berridge, PLC
- Priority: JP2009-038973 20090223
- Main IPC: F16F7/00
- IPC: F16F7/00

Abstract:
A fluid-filled vibration damping device including: a pressure-receiving chamber and an equilibrium chamber disposed on either side of a partition plate, while being connected through a first orifice passage; a moveable film arranged to either a pressure-receiving chamber side or an equilibrium chamber side of the partition plate while being spaced away therefrom to define therebetween an intermediate chamber; a second orifice passage connecting the intermediate chamber and one of the pressure-receiving and the equilibrium chambers while being tuned to higher frequency than the first orifice passage; and a flow straightening plate arranged in opposition to the moveable film at least at one of the intermediate chamber side and an opposite side thereof, the flow straightening plate having a plurality of flow straightening apertures opening towards the moveable film and furnished with a flow limiting member.
Public/Granted literature
- US20100213652A1 FLUID-FILLED VIBRATION DAMPING DEVICE Public/Granted day:2010-08-26
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