Invention Grant
- Patent Title: Dissipative structures and related methods
- Patent Title (中): 耗散结构及相关方法
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Application No.: US12792966Application Date: 2010-06-03
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Publication No.: US08573571B2Publication Date: 2013-11-05
- Inventor: Benjamin R. Langhorst , Henry S. Chu
- Applicant: Benjamin R. Langhorst , Henry S. Chu
- Applicant Address: US ID Idaho Falls
- Assignee: Battelle Energy Alliance, LLC
- Current Assignee: Battelle Energy Alliance, LLC
- Current Assignee Address: US ID Idaho Falls
- Agency: TraskBritt
- Main IPC: F16F3/02
- IPC: F16F3/02

Abstract:
Dissipative structures include at least one panel and a cell structure disposed adjacent to the at least one panel having interconnected cells. A deformable material, which may comprise at least one hydrogel, is disposed within at least one interconnected cell proximate to the at least one panel. Dissipative structures may also include a cell structure having interconnected cells formed by wall elements. The wall elements may include a mesh formed by overlapping fibers having apertures formed therebetween. The apertures may form passageways between the interconnected cells. Methods of dissipating a force include disposing at least one hydrogel in a cell structure proximate to at least one panel, applying a force to the at least one panel, and forcing at least a portion of the at least one hydrogel through apertures formed in the cell structure.
Public/Granted literature
- US20120125726A1 DISSIPATIVE STRUCTURES AND RELATED METHODS Public/Granted day:2012-05-24
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