Invention Grant
- Patent Title: Liquid ejection head wiring member and liquid ejection head
- Patent Title (中): 液体喷射头配线构件和液体喷射头
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Application No.: US13025553Application Date: 2011-02-11
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Publication No.: US08573746B2Publication Date: 2013-11-05
- Inventor: Yoshinao Miyata
- Applicant: Yoshinao Miyata
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2010-034388 20100219
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/05

Abstract:
A wiring member for a liquid ejection head enables reducing the size of the liquid ejection head. A flexible printed circuit has on one end a plurality of individual electrode wiring terminals corresponding to individual element electrode terminals of piezoelectric elements; individual electrode wires corresponding to the individual electrode wiring terminals; a common electrode wiring terminal corresponding to a common electrode terminal of the piezoelectric elements; and a common electrode wire corresponding to the common electrode wiring terminal. The individual electrode wiring terminals, common electrode wiring terminal, and individual electrode wires are disposed on one side of the flexible printed circuit, and the common electrode wire is disposed on the other side of the flexible printed circuit.
Public/Granted literature
- US20110205270A1 LIQUID EJECTION HEAD WIRING MEMBER AND LIQUID EJECTION HEAD Public/Granted day:2011-08-25
Information query
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