Invention Grant
- Patent Title: Methods for manufacturing liquid ejecting head and piezoelectric element, liquid ejecting head, liquid ejecting apparatus, and piezoelectric element
- Patent Title (中): 液体喷射头和压电元件的制造方法，液体喷射头，液体喷射装置和压电元件
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Application No.: US12983833Application Date: 2011-01-03
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Publication No.: US08573754B2Publication Date: 2013-11-05
- Inventor: Masahisa Nawano , Takayuki Yonemura , Tomokazu Kobayashi
- Applicant: Masahisa Nawano , Takayuki Yonemura , Tomokazu Kobayashi
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2010-000828 20100105
- Main IPC: B41J2/045
- IPC: B41J2/045 ; H01L41/047
Abstract:
A method for manufacturing a piezoelectric element comprising forming a titanium film containing titanium; forming a platinum film containing platinum on the titanium film; forming a piezoelectric precursor film containing bismuth, lanthanum, iron and manganese on the platinum film; crystallizing the piezoelectric precursor film to form a piezoelectric layer by firing the piezoelectric precursor film in an atmosphere of an inert gas; and forming an electrode on the piezoelectric layer.
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