Invention Grant
- Patent Title: Connectionless cooling system
- Patent Title (中): 无连接冷却系统
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Application No.: US13107877Application Date: 2011-05-14
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Publication No.: US08573834B2Publication Date: 2013-11-05
- Inventor: Tadeusz Bik
- Applicant: Tadeusz Bik
- Applicant Address: CA Mississauga
- Assignee: Honeywell ASCa Inc.
- Current Assignee: Honeywell ASCa Inc.
- Current Assignee Address: CA Mississauga
- Agency: Cascio Schmoyer & Zervas
- Main IPC: G01N25/00
- IPC: G01N25/00

Abstract:
Mobile devices are re-supplied with fluids on a periodic basis thereby eliminating the need to maintain a permanent connection between an external fluid supply and the moving device. Electronic scanning devices generate heat and operate at varying and high temperature conditions that interfere with operations of the scanner heads. Circulating a heat transfer fluid through the sensor head removes excess heat from heat sensitive regions of the sensor head during operations. Once the heat transfer fluid reaches a predetermined temperature or after passage of a predetermined length of time, the scanner head is maneuvered to a docking station where it is coupled to an external heat fluid source where fresh fluid is supplied to the scanner head.
Public/Granted literature
- US20120285235A1 Connectionless Cooling System Public/Granted day:2012-11-15
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