Invention Grant
- Patent Title: Apparatus and method for evaluating a substrate mounting device
- Patent Title (中): 用于评价基板安装装置的装置和方法
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Application No.: US11925158Application Date: 2007-10-26
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Publication No.: US08573836B2Publication Date: 2013-11-05
- Inventor: Yasuharu Sasaki , Takehiro Ueda , Taketoshi Okajo , Kaoru Oohashi
- Applicant: Yasuharu Sasaki , Takehiro Ueda , Taketoshi Okajo , Kaoru Oohashi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2006-290840 20061026
- Main IPC: G01N17/00
- IPC: G01N17/00 ; H01L21/00

Abstract:
An apparatus evaluates a substrate mounting device adapted to hold a target substrate placed on a mounting surface and to control a temperature of the target substrate. The apparatus includes an evacuatable airtightly sealed chamber accommodating therein the substrate mounting device, a heat source, arranged in a facing relationship with the mounting surface, for irradiating infrared light. The apparatus further includes an evaluation-purpose substrate adapted to be mounted on the mounting surface in place of the target substrate, the evaluation-purpose substrate being made of an infrared light absorbing material, and having a unit for measuring temperatures at plural sites on a surface and/or inside of the substrate.
Public/Granted literature
- US20080098833A1 APPARATUS AND METHOD FOR EVALUATING A SUBSTRATE MOUNTING DEVICE Public/Granted day:2008-05-01
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