Invention Grant
- Patent Title: Cover structure
- Patent Title (中): 封面结构
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Application No.: US13314298Application Date: 2011-12-08
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Publication No.: US08573990B2Publication Date: 2013-11-05
- Inventor: Hsu-Chih Cheng , Chia-Hua Chu , Bo-Shiun Luo
- Applicant: Hsu-Chih Cheng , Chia-Hua Chu , Bo-Shiun Luo
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW00132016A 20110906
- Main IPC: H01R13/44
- IPC: H01R13/44

Abstract:
A cover structure, adapted for mounting on a housing that is formed with an opening and a connection base having a plugging end exposing by the opening, comprising: a frame, formed with a first end and a second end that are arranged opposite to each other with respect to the radial of a coupling position where the frame is coupled to the housing through a pivot axis of two pivot blocks in a direction parallel to a first axis direction and enabling the first end to expose by the opening; and an elastic element, disposed inside the housing for providing an elastic force to the frame, for enabling the first end and the second end to move relative to each other centering the coupling position; wherein an accommodation space is formed between the frame and the connection base so as to be used for receiving a plug of a connector.
Public/Granted literature
- US20130059454A1 COVER STRUCTURE Public/Granted day:2013-03-07
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