Invention Grant
US08574033B2 Wafer support member, method for manufacturing the same and wafer polishing unit comprising the same
有权
晶片支撑构件，其制造方法以及包括该晶片抛光单元的晶片抛光单元
- Patent Title: Wafer support member, method for manufacturing the same and wafer polishing unit comprising the same
- Patent Title (中): 晶片支撑构件，其制造方法以及包括该晶片抛光单元的晶片抛光单元
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Application No.: US12899131Application Date: 2010-10-06
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Publication No.: US08574033B2Publication Date: 2013-11-05
- Inventor: Jae Chel Sung
- Applicant: Jae Chel Sung
- Applicant Address: KR Gumi, Gyeongsangbukpdo
- Assignee: LG Siltron Inc.
- Current Assignee: LG Siltron Inc.
- Current Assignee Address: KR Gumi, Gyeongsangbukpdo
- Agency: KED & Associates, LLP
- Priority: KR10-2009-0095195 20091007; KR10-2010-0091172 20100916
- Main IPC: B24B1/00
- IPC: B24B1/00
Abstract:
Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support.
Public/Granted literature
- US20110081841A1 WAFER SUPPORT MEMBER, METHOD FOR MANUFACTURING THE SAME AND WAFER POLISHING UNIT COMPRISING THE SAME Public/Granted day:2011-04-07
Information query
