Invention Grant
- Patent Title: Thermally enhanced ultrasonic probe
- Patent Title (中): 热增强超声波探头
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Application No.: US11825781Application Date: 2007-07-09
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Publication No.: US08574159B2Publication Date: 2013-11-05
- Inventor: Takashi Kondoh
- Applicant: Takashi Kondoh
- Applicant Address: JP Tokyo
- Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Edwards Wildman Palmer LLP
- Agent Scott D. Wofsy; David J. Silva
- Priority: JP2006-189749 20060710
- Main IPC: A61B8/14
- IPC: A61B8/14 ; H01L41/083

Abstract:
The present invention relates to an ultrasonic probe provided with a piezoelectric element for ultrasonic generation that has drive electrodes formed on two main surfaces thereof; an acoustic matching layer formed on the first main surface side of the piezoelectric element; a backing member attached to the second main surface side of the piezoelectric element; a base for heat dissipation provided on a lower surface of the backing member; and a thin metal plate for heat transfer that is thermally bonded between at least one of the main surfaces of the piezoelectric element and the base for heat dissipation; wherein the thin metal plate for heat transfer is surface-bonded to extend from one end of the piezoelectric element over the center thereof toward the other end. This configuration ensures that heat generated by the electrical-mechanical conversion of the piezoelectric element is transferred away in a satisfactory manner, enabling suppression of any temperature rise in the piezoelectric element.
Public/Granted literature
- US20080009742A1 Ultrasonic probe Public/Granted day:2008-01-10
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