Invention Grant
- Patent Title: Intervertebral device having expandable endplates
- Patent Title (中): 具有可扩展端板的椎间装置
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Application No.: US13281833Application Date: 2011-10-26
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Publication No.: US08574297B2Publication Date: 2013-11-05
- Inventor: Shawn D Stad , Christopher L Ramsay
- Applicant: Shawn D Stad , Christopher L Ramsay
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, LLC
- Current Assignee: DePuy Synthes Products, LLC
- Current Assignee Address: US MA Raynham
- Main IPC: A61F2/44
- IPC: A61F2/44

Abstract:
An intervertebral implant having an endplate that can be slidably expanded following its placement in the intervertebral space.
Public/Granted literature
- US20120041561A1 INTERVERTEBRAL DEVICE HAVING EXPANDABLE ENDPLATES Public/Granted day:2012-02-16
Information query
IPC分类: