Invention Grant
- Patent Title: Method of magnetron sputtering and a method for determining a power modulation compensation function for a power supply applied to a magnetron sputtering source
- Patent Title (中): 磁控溅射方法以及用于确定施加到磁控溅射源的电源的功率调制补偿功能的方法
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Application No.: US13551815Application Date: 2012-07-18
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Publication No.: US08574409B2Publication Date: 2013-11-05
- Inventor: Stanislav Kadlec , Frantisek Balon , Juergen Weichart , Bart Scholte van Mast
- Applicant: Stanislav Kadlec , Frantisek Balon , Juergen Weichart , Bart Scholte van Mast
- Applicant Address: LI Balzers
- Assignee: OC oerlikon Balzers AG
- Current Assignee: OC oerlikon Balzers AG
- Current Assignee Address: LI Balzers
- Agency: Pearne & Gordon LLP
- Main IPC: C23C14/00
- IPC: C23C14/00 ; H01L21/00
Abstract:
A method of magnetron sputtering, comprises rotating a magnet of a magnetron with an angular frequency ω, and, during sputtering of material from a source of the magnetron onto a substrate, periodically modulating a power level applied to the source with at least a component comprising a frequency f which is a harmonic of the angular frequency ω of rotation of the magnet other than the first harmonic.
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