A processing method for a mold (1) to form a pattern of recessed portions (13) on a product forming surface (11) formed on the mold (1) includes a photoresist forming step in which a thermally deformable heat-mode photoresist layer (12) is formed on the product forming surface (11), a laser beam illumination step in which a laser beam is applied to the photoresist layer (12) by an exposure device incorporating a semiconductor laser to form a pattern of recessed portions (13), and an asperity forming step in which asperities are formed on the product forming surface (11) by making use of the pattern of recessed portions (13).