Invention Grant
- Patent Title: Single-layer PCB microfluidics
- Patent Title (中): 单层PCB微流体
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Application No.: US13448810Application Date: 2012-04-17
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Publication No.: US08574513B2Publication Date: 2013-11-05
- Inventor: Samson Chen , Aditya Rajagopal , Axel Scherer
- Applicant: Samson Chen , Aditya Rajagopal , Axel Scherer
- Applicant Address: US CA Pasadena
- Assignee: California Institute of Technology
- Current Assignee: California Institute of Technology
- Current Assignee Address: US CA Pasadena
- Agency: Steinfl & Bruno, LLP
- Main IPC: G01N15/06
- IPC: G01N15/06
Abstract:
A printed circuit board structure is coated with an encapsulant within which microfluidic channels have been formed. The microfluidic channels are formed by soldering fluidic connections to metal traces on a surface of the printed circuit board structure prior to encapsulation. The metal traces are removed by etching after encapsulation to form microchannels within the encapsulant.
Public/Granted literature
- US20120267239A1 SINGLE-LAYER PCB MICROFLUIDICS Public/Granted day:2012-10-25
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