Invention Grant
- Patent Title: Electronic device housing assembly
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Application No.: US11888407Application Date: 2007-07-31
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Publication No.: US08574696B2Publication Date: 2013-11-05
- Inventor: Jeffrey A. Lev , Steven S. Homer
- Applicant: Jeffrey A. Lev , Steven S. Homer
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B32B1/00
- IPC: B32B1/00 ; B32B3/10 ; B32B5/02
Abstract:
An electronic device comprising a housing assembly having at least one fiber composite layer molded into a portion of the housing assembly, the at least one fiber composite layer having a warp direction and configured to provide strength to the housing assembly corresponding to the warp direction.
Public/Granted literature
- US20090035549A1 Electronic device housing assembly Public/Granted day:2009-02-05
Information query
