Invention Grant
- Patent Title: Use of a polyamide molding compound for lining conduits
- Patent Title (中): 使用聚酰胺模塑料衬套管道
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Application No.: US12676752Application Date: 2008-09-30
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Publication No.: US08574697B2Publication Date: 2013-11-05
- Inventor: Andreas Dowe , Ralf Tuellmann , Reinhard Beuth , Franz-Erich Baumann
- Applicant: Andreas Dowe , Ralf Tuellmann , Reinhard Beuth , Franz-Erich Baumann
- Applicant Address: DE Essen
- Assignee: Evonik Degussa GmbH
- Current Assignee: Evonik Degussa GmbH
- Current Assignee Address: DE Essen
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: DE102007050011 20071017; DE102008001678 20080509
- International Application: PCT/EP2008/063050 WO 20080930
- International Announcement: WO2009/050031 WO 20090423
- Main IPC: B29D22/00
- IPC: B29D22/00 ; F16L11/00

Abstract:
In a method for the introduction of an inliner into a pipe or a pipeline, where the external diameter of the inliner is greater than the internal diameter of the pipe or of the pipeline, and where the action of an external force is used to reduce the cross section of the inliner prior to the introduction, the inliner is composed of a polyamide moulding composition which comprises at least 50% by weight of polyamide which is not PA11. The recovery behavior of said polyamides is similar to that of polyethylene usually used for this purpose.
Public/Granted literature
- US20100300573A1 USE OF A POLYAMIDE MOLDING COMPOUND FOR LINING CONDUITS Public/Granted day:2010-12-02
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