Invention Grant
US08574930B2 Tool cutting method for workpiece having a plurality of LED chips sealed by sealing member
有权
具有由密封构件密封的多个LED芯片的工件的切削方法
- Patent Title: Tool cutting method for workpiece having a plurality of LED chips sealed by sealing member
- Patent Title (中): 具有由密封构件密封的多个LED芯片的工件的切削方法
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Application No.: US13706616Application Date: 2012-12-06
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Publication No.: US08574930B2Publication Date: 2013-11-05
- Inventor: Kazuma Sekiya
- Applicant: Disco Corporation
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2011-285576 20111227
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
A tool cutting method which includes a correlation table preparing step of preparing a correlation table indicating the correlation between the brightness of light emitted from LED chips and the thickness of a sealing member, a brightness measuring step of measuring the brightness of light emitted from the LED chips by applying a voltage to the LED chips, a calculating step of calculating the thickness of the sealing member corresponding to the desired thickness from the brightness measured in the brightness measuring step and the correlation table, and a cutting step of cutting the sealing member by using a tool cutting unit after performing the calculating step to reduce the thickness of the sealing member to a finished thickness providing the desired brightness of light emitted from the LED chips.
Public/Granted literature
- US20130164864A1 TOOL CUTTING METHOD FOR WORKPIECE HAVING A PLURALITY OF LED CHIPS SEALED BY SEALING MEMBER Public/Granted day:2013-06-27
Information query
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