Invention Grant
US08574931B2 Singulation and strip testing of no-lead integrated circuit packages without tape frame
有权
无磁带框架的无引线集成电路封装的单片和条形测试
- Patent Title: Singulation and strip testing of no-lead integrated circuit packages without tape frame
- Patent Title (中): 无磁带框架的无引线集成电路封装的单片和条形测试
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Application No.: US13078092Application Date: 2011-04-01
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Publication No.: US08574931B2Publication Date: 2013-11-05
- Inventor: Donald C Abbott
- Applicant: Donald C Abbott
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/56
Abstract:
Strip testing is applied to a plurality of integrated circuit dies that are each encapsulated in an encapsulant, that each have a set of externally accessible leads connected thereto, and that are electrically isolated from one another. Provision is made for the strip testing to be performed without mounting the encapsulated integrated circuit dies on a support tape.
Public/Granted literature
- US20120252142A1 Singulation and Strip Testing of No-Lead Integrated Circuit Packages Without Tape Frame Public/Granted day:2012-10-04
Information query
IPC分类:
