Invention Grant
- Patent Title: Method for manufacturing nonvolatile semiconductor memory element
- Patent Title (中): 制造非易失性半导体存储元件的方法
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Application No.: US13502769Application Date: 2011-11-10
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Publication No.: US08574957B2Publication Date: 2013-11-05
- Inventor: Takumi Mikawa , Yukio Hayakawa , Takeki Ninomiya , Yoshio Kawashima
- Applicant: Takumi Mikawa , Yukio Hayakawa , Takeki Ninomiya , Yoshio Kawashima
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-254314 20101112
- International Application: PCT/JP2011/006302 WO 20111110
- International Announcement: WO2012/063495 WO 20120518
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
An object of the present invention is to provide a method for manufacturing a variable resistance nonvolatile semiconductor memory element which can operate at a low voltage and high speed when initial breakdown is caused, and inhibit oxidization of a contact plug. The method for manufacturing the variable resistance nonvolatile semiconductor memory element, which includes a bottom electrode, a variable resistance layer, and a top electrode which are formed above a contact plug, includes oxidizing to insulate an end portion of the variable resistance layer prior to forming a bottom electrode by patterning a first conductive film.
Public/Granted literature
- US20120238055A1 METHOD FOR MANUFACTURING NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT Public/Granted day:2012-09-20
Information query
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