Invention Grant
US08575290B2 Silicone resin composition, silicone resin sheet, optical semiconductor element device, and producing method of silicone resin sheet
有权
硅树脂组合物，硅树脂片，光半导体元件装置以及有机硅树脂片的制造方法
- Patent Title: Silicone resin composition, silicone resin sheet, optical semiconductor element device, and producing method of silicone resin sheet
- Patent Title (中): 硅树脂组合物，硅树脂片，光半导体元件装置以及有机硅树脂片的制造方法
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Application No.: US13469452Application Date: 2012-05-11
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Publication No.: US08575290B2Publication Date: 2013-11-05
- Inventor: Munehisa Mitani , Hiroyuki Katayama , Haruka Fujii
- Applicant: Munehisa Mitani , Hiroyuki Katayama , Haruka Fujii
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-124490 20110602; JP2011-131537 20110613
- Main IPC: C08G77/08
- IPC: C08G77/08
Abstract:
A silicone resin composition contains a first organopolysiloxane having, in one molecule, both at least two ethylenically unsaturated hydrocarbon groups and at least two hydrosilyl groups; a second organopolysiloxane having, in one molecule, at least two hydrosilyl groups without containing an ethylenically unsaturated hydrocarbon group; a hydrosilylation catalyst; and a hydrosilylation inhibitor.
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