Invention Grant
- Patent Title: Printed circuit board with multi-layer ceramic capacitor array
- Patent Title (中): 带多层陶瓷电容阵列的印刷电路板
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Application No.: US13166772Application Date: 2011-06-22
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Publication No.: US08575494B2Publication Date: 2013-11-05
- Inventor: Chun-Yuan Tien
- Applicant: Chun-Yuan Tien
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis & Wispro Law Group, Inc.
- Priority: TW100114532A 20110426
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
A printed circuit board (PCB) includes a bank or matrix of multi-layer ceramic capacitors (MLCCs). Each MLCC includes positive and negative electrodes respectively connected to a power layer and a ground layer of the PCB through two positive and two negative vias. A portion of the positive vias and a portion of the negative vias utilized by the same column of MLCCs are arranged in two separated lines along the flowing direction of current streams in the power layer.
Public/Granted literature
- US20120273265A1 PRINTED CIRCUIT BOARD WITH MULTI-LAYER CERAMIC CAPACITOR ARRAY Public/Granted day:2012-11-01
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