Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13119210Application Date: 2009-09-01
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Publication No.: US08575615B2Publication Date: 2013-11-05
- Inventor: Yuichi Saito , Masao Moriguchi , Tokuo Yoshida , Yasuaki Iwase , Yohsuke Kanzaki , Mayuko Sakamoto
- Applicant: Yuichi Saito , Masao Moriguchi , Tokuo Yoshida , Yasuaki Iwase , Yohsuke Kanzaki , Mayuko Sakamoto
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Keating & Bennett, LLP
- Priority: JP2008-238485 20080917
- International Application: PCT/JP2009/004288 WO 20090901
- International Announcement: WO2010/032386 WO 20100325
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L29/10 ; H01L29/04 ; H01L31/036

Abstract:
A diode 201 includes a gate electrode 2, a gate insulating layer 5 provided on the gate electrode 2, at least one semiconductor layer 6, 7 provided on the gate insulating layer 5 and which includes a first region 6a and a second region 7b, a first electrode 10 which is provided on the first region 6a and which is electrically coupled to the first region 6a and the gate electrode 2, and a second electrode 12 which is provided on the second region 7b and which is electrically coupled to the second region 7b. The at least one semiconductor layer 6, 7 includes a channel region 6c which extends above the gate electrode 2 with the intervention of the gate insulating layer 5 therebetween, and a resistor region 7d which does not extend above the gate electrode 2. When the diode 201 is in an ON state, an electric current path is formed between the first electrode 10 and the second electrode 12, the electric current path including the channel region 6c and the resistor region 7d.
Public/Granted literature
- US20110169005A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-07-14
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