Invention Grant
- Patent Title: Semiconductor element mounting member, method of producing the same, and semiconductor device
- Patent Title (中): 半导体元件安装构件及其制造方法以及半导体装置
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Application No.: US13564426Application Date: 2012-08-01
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Publication No.: US08575625B2Publication Date: 2013-11-05
- Inventor: Kouichi Takashima , Yoshifumi Aoi , Eiji Kamijo
- Applicant: Kouichi Takashima , Yoshifumi Aoi , Eiji Kamijo
- Applicant Address: JP
- Assignee: A.L.M.T. Corp.
- Current Assignee: A.L.M.T. Corp.
- Current Assignee Address: JP
- Agency: St. Onge Steward Johnston & Reens LLC
- Priority: JP2010-025480 20100208
- Main IPC: H01L29/15
- IPC: H01L29/15
Abstract:
A semiconductor element mounting member is arranged to infiltrate a matrix metal into a porous body that is formed by sintering diamond particles being in direct contact with each other and that has an infiltration auxiliary layer selectively formed only on the exposed surface of each diamond particle. A production method includes a step at which a mixture of diamond particles, a powder of a chemical element out of which the infiltration auxiliary layer is made, and an ammonium chloride powder is compressed and molded, is then heated to 900° C. or more, and is formed into the porous body. A semiconductor device has a semiconductor element mounted on an element mounting surface of the semiconductor element mounting member with a connecting layer therebetween.
Public/Granted literature
- US20120292769A1 SEMICONDUCTOR ELEMENT MOUNTING MEMBER, METHOD OF PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE Public/Granted day:2012-11-22
Information query
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