Invention Grant
- Patent Title: Light-emitting device, method for manufacturing same, molded body and sealing member
- Patent Title (中): 发光装置,制造方法,成型体和密封构件
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Application No.: US11997734Application Date: 2006-07-28
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Publication No.: US08575632B2Publication Date: 2013-11-05
- Inventor: Masafumi Kuramoto , Tomohide Miki , Tomoya Tsukioka , Tomohisa Kishimoto
- Applicant: Masafumi Kuramoto , Tomohide Miki , Tomoya Tsukioka , Tomohisa Kishimoto
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2005-226083 20050804
- International Application: PCT/JP2006/314970 WO 20060728
- International Announcement: WO2007/015426 WO 20070208
- Main IPC: H01L33/32
- IPC: H01L33/32 ; H01L33/60 ; H01L33/00 ; C08L63/00

Abstract:
Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.
Public/Granted literature
- US20100155739A1 LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, MOLDED BODY AND SEALING MEMBER Public/Granted day:2010-06-24
Information query
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