Invention Grant
- Patent Title: Non-planar quantum well device having interfacial layer and method of forming same
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Application No.: US12924307Application Date: 2010-09-24
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Publication No.: US08575653B2Publication Date: 2013-11-05
- Inventor: Willy Rachmady , Ravi Pillarisetty , Van H. Le , Robert Chau
- Applicant: Willy Rachmady , Ravi Pillarisetty , Van H. Le , Robert Chau
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
Techniques are disclosed for forming a non-planar quantum well structure. In particular, the quantum well structure can be implemented with group IV or III-V semiconductor materials and includes a fin structure. In one example case, a non-planar quantum well device is provided, which includes a quantum well structure having a substrate (e.g. SiGe or GaAs buffer on silicon), a IV or III-V material barrier layer (e.g., SiGe or GaAs or AlGaAs), and a quantum well layer. A fin structure is formed in the quantum well structure, and an interfacial layer provided over the fin structure. A gate metal can be deposited across the fin structure. Drain/source regions can be formed at respective ends of the fin structure.
Public/Granted literature
- US20120074386A1 Non-planar quantum well device having interfacial layer and method of forming same Public/Granted day:2012-03-29
Information query
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