Invention Grant
- Patent Title: Semiconductor storage device and method for manufacturing the same
- Patent Title (中): 半导体存储装置及其制造方法
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Application No.: US12585947Application Date: 2009-09-29
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Publication No.: US08575676B2Publication Date: 2013-11-05
- Inventor: Yuichi Nakao
- Applicant: Yuichi Nakao
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2008-253085 20080930
- Main IPC: H01L29/788
- IPC: H01L29/788

Abstract:
A semiconductor storage device according to the present invention includes: a semiconductor substrate; an embedded insulator embedded in a trench formed in the semiconductor substrate and having an upper portion protruding above a top surface of the semiconductor substrate; a first insulating film formed on the top surface of the semiconductor substrate; a floating gate formed on the first insulating film at a side of the embedded insulator, having a side portion arching out above the embedded insulator, and having a side surface made of a flat surface and a curved surface continuing below the flat surface; a second insulating film contacting an upper surface, the flat surface and the curved surface of the floating gate; and a control gate opposing the upper surface, the flat surface and the curved surface of the floating gate across the second insulating film.
Public/Granted literature
- US20100078702A1 Semiconductor storage device and method for manufacturing the same Public/Granted day:2010-04-01
Information query
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