Provided is a semiconductor device in which on-resistance is largely reduced. The semiconductor device includes an n type epitaxial layer in which each region between neighboring trenches becomes a channel, and a plurality of embedded electrodes each of which is formed on an inner surface of each trench via a silicon oxide film. The plurality of embedded electrodes include two types of embedded electrodes to which voltages are applied separately. By blocking each region between neighboring trenches with a depletion layer formed around every trench, current flowing through each region between the neighboring trenches is interrupted. By deleting the depletion layer formed around the trench filled with the embedded electrode, current can flow through each region between neighboring trenches.