Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13415482Application Date: 2012-03-08
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Publication No.: US08575704B2Publication Date: 2013-11-05
- Inventor: Masaki Haneda , Akiyoshi Hatada , Akira Katakami , Yuka Kase , Kazuya Okubo
- Applicant: Masaki Haneda , Akiyoshi Hatada , Akira Katakami , Yuka Kase , Kazuya Okubo
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2011-092285 20110418
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L21/336

Abstract:
A semiconductor device includes a semiconductor substrate, a device region including first and second parts, first and second gate electrodes formed in the first and the second parts, first and second source regions, first and second drain regions, first, second, third, and fourth embedded isolation film regions formed under the first source, the first drain, the second source, and the second drain regions, respectively. Further, the first drain region and the second source region form a single diffusion region, the second and the third embedded isolation film regions form a single embedded isolation film region, an opening is formed in a part of the single diffusion region so as to extend to the second and the third embedded isolation film regions, and the opening is filled with an isolation film.
Public/Granted literature
- US20120261760A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE Public/Granted day:2012-10-18
Information query
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