A camera module includes a sensor die, a glass plate, peripheral spacer, an optical element, an outer surface having a shoulder extending in a direction substantially parallel to the sensor die, and a metal layer at least partially covering the outer surface. A method of manufacturing a camera module includes providing an assembly including a sensor dice wafer, a spacer wafer in front of the sensor dice wafer, and an optical element wafer in front of the spacer wafer. The method includes sawing a top cut, using a first saw blade of a first thickness, proceeding in a direction from the optical element wafer toward the sensor dice wafer, stopping before the sensor dice wafer is reached, and sawing a bottom cut, using a second saw blade of a second thickness, proceeding in a direction from the sensor dice wafer toward the optical element wafer.