Invention Grant
- Patent Title: Backside illuminated semiconductor light-receiving device, optical receiver module, and optical transceiver
- Patent Title (中): 背面照明半导体光接收装置,光接收模块和光收发器
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Application No.: US13085604Application Date: 2011-04-13
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Publication No.: US08575714B2Publication Date: 2013-11-05
- Inventor: Takashi Toyonaka , Hiroshi Hamada , Masataka Yokosawa
- Applicant: Takashi Toyonaka , Hiroshi Hamada , Masataka Yokosawa
- Applicant Address: JP Kanagawa
- Assignee: Oclaro Japan, Inc.
- Current Assignee: Oclaro Japan, Inc.
- Current Assignee Address: JP Kanagawa
- Agency: Mattingly & Malur, PC
- Priority: JP2010-114313 20100518; JP2011-050848 20110308
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
Provided is a backside illuminated semiconductor light-receiving device enhancing a frequency characteristic without deteriorating assembling operability. The light-receiving device includes a rectangular substrate; a light receiving mesa portion formed on a center portion of one side on a front surface of the substrate and includes a PN junction portion; a P-type electrode formed on the light receiving mesa portion and conductive with one side of the PN junction portion; an N-type electrode mesa portion formed on one corner portion of the one side; an N-type electrode pulled out to the N-type electrode mesa portion and conductive with the other side of the PN junction portion; a P-type electrode mesa portion and a dummy electrode mesa portion formed in a region including three other corner portions; and a dummy electrode formed on the dummy electrode mesa portion.
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