Invention Grant
US08575723B2 Detection circuit and method for detecting damage to a semiconductor chip
有权
用于检测对半导体芯片的损坏的检测电路和方法
- Patent Title: Detection circuit and method for detecting damage to a semiconductor chip
- Patent Title (中): 用于检测对半导体芯片的损坏的检测电路和方法
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Application No.: US11837187Application Date: 2007-08-10
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Publication No.: US08575723B2Publication Date: 2013-11-05
- Inventor: Andreas Tschmelitsch , Gerhard Zojer , Guenter Holl , Guenter Herzele
- Applicant: Andreas Tschmelitsch , Gerhard Zojer , Guenter Holl , Guenter Herzele
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Banner & Witcoff, Ltd.
- Priority: DE102006037633 20060810
- Main IPC: H01L23/544
- IPC: H01L23/544
Abstract:
A semiconductor chip having a current source coupled between a first potential and an electrical node, a detection circuit having an input coupled to the electrical node, and a first active component coupled in series with the current source and further coupled between the electrical node and a second potential, wherein the first active component is coupled to the electrical node via a first conductive interconnect.
Public/Granted literature
- US20080035923A1 Semiconductor Device With Damage Detection Circuit and Method for Producing the Same Public/Granted day:2008-02-14
Information query
IPC分类:
