Invention Grant
- Patent Title: Gate structures
- Patent Title (中): 门结构
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Application No.: US13886123Application Date: 2013-05-02
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Publication No.: US08575727B2Publication Date: 2013-11-05
- Inventor: Peng-Soon Lim , Chia-Pin Lin , Kuang-Yuan Hsu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
A semiconductor device is provided. The device includes a semiconductor substrate, first and second projections extending upwardly from the substrate, the projections having respective first and second channel regions therein, and a first gate structure engaging the first projection adjacent the first channel region. The first gate structure includes a first dielectric material over the first channel region, a first opening over the first dielectric material and the first channel region, and a pure first metal with an n-type work function value conformally deposited in the first opening. The device also includes a second gate structure engaging the second projection adjacent the second channel region. The second gate structure includes a second dielectric material over the second channel region, a second opening over the second dielectric material and the second channel region, and a pure second metal with a p-type work function value conformally deposited in the second opening.
Public/Granted literature
- US20130240979A1 GATE STRUCTURES Public/Granted day:2013-09-19
Information query
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