Invention Grant
- Patent Title: Printed board and semiconductor integrated circuit
- Patent Title (中): 印刷电路板和半导体集成电路
-
Application No.: US13225740Application Date: 2011-09-06
-
Publication No.: US08575743B2Publication Date: 2013-11-05
- Inventor: Takuya Mukaibara
- Applicant: Takuya Mukaibara
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2006-053802 20060228
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
An IC which includes a first circuit and a plurality of first paired terminals each including a first power supply terminal and a first GND terminal which are connected to the first circuit, and a second circuit and a plurality of second paired terminals each including a second power supply terminal and a second GND terminal which are connected to the second circuit. The first and second paired terminals are isolated inside. A printed board with the IC mounted has an inductor which is provided in a route that guides a wiring line from the first GND terminal to the second GND terminal and the GND of the printed board. The printed board has a portion where each of the first GND terminals is arranged inside the terminal array of the IC. The inductor suppresses a high-frequency potential variation generated by the operation of the first circuit.
Public/Granted literature
- US20110317384A1 PRINTED BOARD AND SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2011-12-29
Information query
IPC分类: