Invention Grant
- Patent Title: Chip on flexible printed circuit type semiconductor package
- Patent Title (中): 芯片采用柔性印刷电路式半导体封装
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Application No.: US11878016Application Date: 2007-07-20
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Publication No.: US08575746B2Publication Date: 2013-11-05
- Inventor: Si-Hoon Lee , Sa-Yoon Kang , Kyoung-Sei Choi
- Applicant: Si-Hoon Lee , Sa-Yoon Kang , Kyoung-Sei Choi
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2006-0068173 20060720; KR10-2006-0108910 20061106
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L23/34
Abstract:
A Chip on Flexible Printed Circuit (COF) type semiconductor package may include a flexible film, a semiconductor IC chip on the flexible film, and a heating pad on the flexible film.
Public/Granted literature
- US20080023822A1 Chip on flexible printed circuit type semiconductor package Public/Granted day:2008-01-31
Information query
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